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Micron to tap IBM chip-stacking tech for fast memory

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM.<img src="http://feeds.feedburner.com/~r/cnet/tcoc/~4/JmcOWWUKOrg" height="1" width="1"/> [More]

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