IBM, 3M team up on 3D semiconductor 'glue'
3M and IBM hope to roll out 3D chip adhesives in 2013. Get ready for processors with stacks of 100 chips.<img src="http://feeds.feedburner.com/~r/cnet/tcoc/~4/uPBX0v7INLg" height="1" width="1"/> [More]
3M and IBM hope to roll out 3D chip adhesives in 2013. Get ready for processors with stacks of 100 chips.<img src="http://feeds.feedburner.com/~r/cnet/tcoc/~4/uPBX0v7INLg" height="1" width="1"/> [More]